Wafer Dicing and Saw Engineer in Addison, TX at Volt

Date Posted: 8/1/2018

Job Snapshot

  • Employee Type:
    Direct Hire
  • Location:
    Addison, TX
  • Duration:
  • Date Posted:
  • Job ID:
  • Pay Rate
    $80000.0 - $120000.0/Year
  • Contact Name
    Volt Branch
  • Phone

Job Description

Wafer Dicing/Saw Engineer

Do you have experience designing and developing a variety of dicing and saw processes for MEMS or semiconductor devices?

Are you a skilled Engineer who likes challenges and bonuses with a great company? 

This might be the right opportunity for you!!

Seeking experience designing and developing a variety of dicing and saw processes for MEMS or semiconductor devices. This is a key individual-contributor position that supports various unique MEMS sensor and device programs. You will be responsible for developing, maintaining, and optimizing dicing processes and equipment used to create various MEMS devices. You will be expected to provide the team with expertise in wafer mounting, wafer dicing, and post dicing wafer cleans. You may also be asked to support other backend processing such as backgrinding, CMP, and die bonding activities. 

In this role you will partner with process integration engineer and customer program managers to setup wafer dicing and saw processes, optimize and validate processes to ensure product specifications are met, and to work with equipment suppliers and vendors to help maintain the overall health and processes on the equipment.

This position is located in our MEMS R&D and Production facility located in Addison, Texas.  The right fit technically and culturally will be self-motivated with a strong dedication to achieving desired results. Must be able to successfully multitask and balance a significant number of priorities.

You must be comfortable solving problems and making technical decisions utilizing a variety of experimental approaches. You should have strong familiarity utilizing statistical process control to control product, processes, and equipment. Your ability to communicate and present ideas to internal team members and external customers is crucial for this position.

Experience and Skills

•         BS/MS/PhD in Physics, Electrical Engineering, Chemistry, Materials Science, or

other relevant technical degrees

•         Technical expertise in wafer dicing, post dicing cleans, and wafer mounting

processing and equipment

•         Experience with other backend processes such as backgrinding, CMP, and die

bonding is a plus for this role

•         A proven track record of MEMS or semiconductor process development including

a minimum of two years of industry experience

•         Demonstrated experience in statistical process control (SPC) concepts and

practices, statistical analysis techniques, and design of experiments

•         Candidates must be a US citizen, permanent resident (Green Card), or have an

EAD. Applicants requiring sponsorship are not eligible.

EEO Statement

Equal employment opportunity to all individuals regardless of their race, color, creed, religion, gender, age, sexual orientation, national origin, disability, veteran status, or any other characteristic protected by state, federal, or local law.